Ddos 
Broadcom recently announced the launch of its Tomahawk 6 switch processor chip, specifically designed for data centers. It boasts the capability to handle up to 102.4 Tbps of data throughput on a single chip, addressing the immense interconnect demands of large-scale GPU clusters used in high-performance computing.
A single Tomahawk 6 can power up to 100,000 GPUs working in tandem, with a peak data throughput equivalent to processing 25,000 4K-resolution movies per second. This represents a sixfold increase in throughput compared to its predecessor, the Tomahawk 5, and delivers six times the performance of traditional Ethernet switching systems.
To achieve this heightened throughput, Broadcom has implemented 100G/200G SerDes interfaces in the Tomahawk 6, along with a co-packaged optics (CPO) design. This innovation meets the demands of large-scale data processing applications, including artificial intelligence workloads.
As the need for massive GPU collaboration in data centers grows, traditional Ethernet-based architectures have resulted in GPU cluster utilization rates falling below 40%. However, with the enhanced data-handling capabilities of the Tomahawk 6, GPU utilization can be elevated to 90%, enabling the efficient training and inference of AI models with over a trillion parameters.
Although Broadcom has emphasized maintaining the unit price of the Tomahawk 6 below $20,000 through a premium technology strategy, manufacturing costs have more than doubled compared to the previous generation. Nevertheless, the chip is projected to reduce overall AI training costs by 30% to 40% due to its superior efficiency.
Broadcom’s key partners currently include industry leaders such as Google, OpenAI, and Meta. An upgraded version of the Tomahawk 6, manufactured with a 3nm process, is expected to debut in the second half of this year.
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